Spektrodensytometru X-rite
Short Term Repeatability - White | Reflectance: 0.1 ∆E94* (D50,2°, mean of 10 measurements every 3 seconds on white) |
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Measurement Geometry | 45°/0° ring illumination optics, ISO 13655:2009 |
Inter-Instrument Agreement | 0.4 ∆E94* average, 1.0 ∆E94* max. (deviation from X-Rite manufacturing standard at a temperature of 23ºC (73.4ºF) on 12 BCRA tiles (D50, 2º)) |
Illumination Spot Size | 3.5 mm (0.14”) |
Light Source | Gas filled tungsten (illuminant type A) and UV LED |
Measurement Conditions | • UV included - ISO 13655:2009 measurement condition M0 • D50 - ISO 13655:2009 measurement condition M1 • UV excluded Filter - ISO 13655:2009 measurement condition M2 |
Measurement Frequency in Scanning Mode | 200 measurements per second |
Patch Size | Minimal Patch Size in Scanning Mode: 7 x 10 mm (0.28” x 0.39”) (Width x Height) with sensor ruler 10 x 10 mm (0.39” x 0.39”) (Width x Height) without sensor ruler |
Photometric Range | 10nm; Sampling interval 3.5nm |
Spectral Analyzer | i1® technology with built-in wavelengths check; Holographic diffraction grating with 128-pixel diode array |
Spectral Range | 380 - 730 nm |
Spectral Reporting | 380 ... 730 nm in 10 nm steps |
Aperture | Measurement aperture: 4.5 mm (0.18”) diameter (effective measurement aperture during scanning is depending on the patch size and measurement speed) |
Calibration |
Manual on external ceramic white reference |
Measurement Background | white, ISO 13655:2009; for measurements on backup board |
Urządzenia Press Color Control
Prędkość pomiaru | 10 cm na sekundę (około 10 sekund dla arkusza B1) |
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Tryb pracy podczas pomiaru | M0 + wybór trybu pomiaru dla wydruku suchego / mokrego. |
Mechanizm przesuwu | łożyskowany z napędem na pasku zębatym - nie wymaga smarowania |
Minimalna szerokość paska kontrolnego | 6 mm |
Położenie arkusza względem pomiaru | regulowane w zakresie 10 - 60 mm od krawędzi arkusza. |
Rodzaj i grubość papier | do 1 mm |
Mierzone kolory | zamiennie CMYK / kolory specjalne |
Sterowanie | dwa przyciski na obudowie lub poprzez komputer |